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[PITCH BLACK] HYTE SOLID PROCESSOR FRAME– SOCKET 1851
Original price was: ₹3,199.00.₹2,099.00Current price is: ₹2,099.00.
✔ Designed for Intel Core Ultra 200S CPUs
✔ LGA1851 Compatibility
✔ CNC Aluminum Construction
✔ Improves Cooler Contact Pressure
✔ Helps Prevent CPU Warping
✔ Includes Thermal Paste & Installation Tool
✔ Air & Liquid Cooler Compatible
✔ 3-Year Warranty
[PITCH BLACK] HYTE SOLID PROCESSOR FRAME– SOCKET 1851
Built specifically for Intel Core Ultra 200S processors, the HYTE Solid Processor Frame improves mounting pressure distribution between the CPU and cooler. By replacing the stock ILM, it helps prevent processor warping caused by thermal cycling while enhancing cooler contact consistency. HYTE includes an installation tool and 2g of Thermal Goop thermal paste, making installation straightforward for enthusiasts and system builders.
KEY FEATURES
- Designed for Intel LGA1851 platform
- Compatible with Intel Core Ultra 200S processors
- Precision-machined aluminum construction
- Optimized cooler contact pressure
- Helps reduce CPU bending and warping
- Includes L-shaped installation tool
- Includes 2g HYTE Thermal Goop thermal paste
- Supports air coolers and AIO liquid coolers
- Enhances long-term thermal consistency
- 3-Year Manufacturer Warranty
What’s in the Box?
- HYTE Solid Processor Frame (LGA1851)
- L-Shaped Installation Tool
- 2g HYTE Thermal Goop Thermal Paste
- Installation Documentation
SPECIFICATIONS
| Specification | Details |
|---|---|
| Product Name | HYTE Solid Processor Frame |
| Socket Support | Intel LGA 1851 |
| CPU Compatibility | Intel Core Ultra 200S Series |
| Material | CNC Aluminum |
| Finish | Snow White |
| Installation Tool | Included L-Shaped Wrench |
| Thermal Paste | 2g HYTE Thermal Goop Included |
| Cooler Compatibility | Air & Liquid Coolers |
| Function | CPU Contact & Pressure Optimization |
| Warranty | 3 Years |
| Color | Snow White |
COMMON USES
1. Intel Core Ultra 200S Systems
Optimized specifically for Intel’s latest desktop platform, helping maintain proper CPU mounting pressure.
2. Lower CPU Temperatures
Improves cooler contact and mounting pressure, helping optimize thermal performance.
3. CPU Protection
Helps prevent processor bending and warping over time due to repeated thermal cycles.
4. Gaming & Creator PCs
Ideal for high-performance gaming rigs, rendering workstations, and enthusiast builds.
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